RPS330

The DFI RPS330 Micro-ATX motherboard supports Intel Bartlett Lake-S and 12th, 13th and 14th Gen Intel Core LGA1700 processors with TDP ratings up to 125W. The Q670E version provides four DDR5 UDIMM sockets supporting up to 192GB, while the H610E version provides two sockets supporting up to 96GB.

Expansion includes one PCIe x16 Gen 5 slot, one PCIe x4 Gen 3 slot and two legacy PCI slots. The motherboard also provides up to two M.2 M-key interfaces for NVMe or SATA storage, with an M.2 E-key interface available on the Q670E model. VGA, DP++ and HDMI 2.0a support three independent displays, while six COM ports, four SATA 3.0 connections and extensive USB connectivity support industrial peripherals. Depending on the model, networking includes dual 2.5GbE or a combination of 2.5GbE and Gigabit Ethernet. The RPS330 suits factory automation, machine control, digital signage and industrial system upgrades.

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RPS330 Micro-ATX industrial motherboard

The RPS330 is a robust Micro-ATX industrial motherboard featuring the Intel Q670E or H610E chipset and supporting 14th, 13th, and 12th Gen Intel Core i9/i7/i5/i3 processors up to 125W. It supports up to 128GB DDR5 memory via four U-DIMM slots and provides flexible expansion with one PCIe x16 Gen5 slot, one PCIe x4 Gen4 slot, and two PCIe x1 slots. The board supports multiple displays through HDMI, DisplayPort, and VGA outputs, and offers abundant connectivity including up to 10 USB ports, 2 COM ports, and dual Intel 2.5GbE LAN. With SATA RAID 0/1/5/10 support, TPM 2.0, and an operating range of -5°C to 65°C, the RPS330 is ideal for smart manufacturing, digital signage, and industrial AI applications.

FEATURES

Computing Type Industrial Micro-ATX Motherboard
Processor Intel 14th/13th/12th Gen Core i9/i7/i5/i3 (up to 125W)
Memory Support 4 x DDR5 U-DIMM up to 128GB
Storage Support 4 x SATA III (RAID 0/1/5/10), 1 x M.2 2280 NVMe
Operating Temperature -5°C to 65°C
Cooling Method Active CPU cooling
Form Factor Micro-ATX

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