APPLICATION
The RPS330-Q670E and RPS330-H610E are Micro-ATX industrial motherboards designed for Intel® 14th, 13th, and 12th Gen LGA1700 processors, supporting up to 125W TDP. Built for high-performance embedded applications, both models offer DDR5 memory up to 192GB, triple display output via VGA, DP++, and HDMI, and wide connectivity options including dual COM ports, USB 3.2 Gen2, and SATA III.
The RPS330-Q670E, based on the Intel® Q670E chipset, includes enterprise-class features like RAID 0/1/5/10 support and Intel® vPro manageability with dual 2.5GbE LAN (I226-LM and I219-LM). In contrast, the RPS330-H610E, using the Intel® H610E chipset, focuses on cost efficiency while maintaining core features such as PCIe Gen 5 x16 expansion, M.2 NVMe storage, and basic dual LAN.
With CE, FCC, and UKCA certifications and extended operating temperature support, both models are ideal for industrial automation, digital signage, and edge computing, offering flexibility across performance and budget requirements.
feature list
Support for 14th/13th/12th Gen Intel® LGA 1700 Socket Processors up to 125W TDP
DDR5 4400 MHz memory support up to 192GB across four UDIMM slots
One PCIe Gen 5 x16 slot
Dual 2.5GbE Ethernet ports (Intel I226-LM/I226-V) with optional vPro support
Triple display outputs
Rich I/O options with USB 3.2 Gen 2, USB 3.2 Gen 1, USB 2.0, and COM ports
Multiple M.2 slots including PCIe x2/x4 NVMe and E-Key
Integrated Realtek ALC888 audio codec
TPM 2.0 hardware security via Nuvoton NPCT760AABYX
High MTBF values
| MODEL NUMBER | CHIPSET | MEMORY | USB |
|---|---|---|---|
| 770-RPS3301-000G | Intel® Q670E Chipset | Up to 192GB | 2 x USB 3.2 Gen1 4 x USB 2.0 (2.54mm pitch) 1 x USB 2.0 vertical Type A |
| 770-RPS3301-200G | Intel® Q670E Chipset | Up to 192GB | 2 x USB 3.2 Gen1 4 x USB 2.0 (2.54mm pitch) 1 x USB 2.0 vertical Type A |
| 770-RPS3301-300G | Intel® H610E Chipset | Up to 192GB | 2 x USB 2.0 (2.54mm pitch) 2 x USB 2.0 (2.54mm pitch), co-lay 1 x USB 2.0 vertical Type A |
Downloads
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