Relec supplies System-on-Modules (SOMs) for embedded and industrial computing applications requiring a compact, scalable computing platform. The range includes COM Express® Mini, Compact and Basic, SMARC and Qseven solutions with Intel, AMD and ARM processor platforms, enabling engineers to separate the core computing architecture from application-specific carrier board design. Options include extended operating temperature models, high-capacity memory and multiple display interfaces for demanding embedded applications. Relec also supports product selection and design-in, helping engineers choose a System-on-Module suited to their processing, I/O, lifecycle and environmental requirements.
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Computing Type: COM Express Mini Module
Processor: Intel Atom x6425RE / x6212RE
Memory Support: Onboard LPDDR4 up to 16GB
Storage Support: Onboard eMMC up to 64GB, 2 x SATA 3.0
Operating Temperature: -40°C to 85°C
Cooling Method: Fanless
Form Factor: COM Express Mini Type 10
Computing Type: COM Express Compact Module
Processor: 13th/12th Gen Intel Core i7/i5/i3, Celeron
Memory Support: Onboard LPDDR5 up to 64GB
Storage Support: 2 x SATA 3.0
Operating Temperature: -40°C to 85°C
Cooling Method: Fanless
Form Factor: COM Express Compact Type 6
Computing Type: COM Express Mini Module
Processor: 11th Gen Intel Core / Celeron / Pentium
Memory Support: LPDDR4x onboard up to 32GB
Storage Support: 1 x SATA III
Operating Temperature: -40°C to 85°C
Cooling Method: Fanless
Form Factor: COM Express Mini Type 10
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