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- DOSA Compliant industry standard package
- 9.6V - 14V Input voltage range
- No derating up to 85ºC, Start-up at -40ºC
- Exceptional thermal performance with minimal airflow
- MTBFs up to 27 million hours
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RoHS lead-free solder and lead-solder-exempted products are available
Delivers up to 16 A (88 W)
No derating up to 85ºC
Surface-mount package
Industry-standard footprint and pinout
Small size and low profile: 1.30” x 0.53” x 0.314” (33.02 x 13.46 x 7.98 mm)
Weight: 0.22 oz [6.12 g]
Coplanarity less than 0.003”, maximum
Synchronouewwwqs Buck Converter topology
Start-up into pre-biased output
No minimum load required
Programmable output voltage via external resistor
Operating ambient temperature: -40 °C to 85 °C
Remote output sense
Remote ON/OFF (Positive or Negative)
Fixed-frequency operation
Auto-reset output overcurrent protection
Auto-reset overtemperature protection
High reliability, MTBF approx. 27.2 million hours calculated per Telcordia TR-332, Method I Case 1
All materials meet UL94, V-0 flammability rating
UL60950 recognition in U.S. & Canada, and DEMKO certification per IEC/EN60950)
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Applications
Intermediate Bus Architectures
Telecommunications
Data communications
Distributed Power Architectures
Servers, workstations
Benefits
High efficiency no heat sink required
Reduces total solution board area
Tape and reel packing
Compatible with pick & place equipment
Minimizes part numbers in inventory
Cost effective
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| Power-One’s point-of-load converters are recommended for use with regulated bus converters in an Intermediate Bus Architecture (IBA). The YS12S16-0G non-isolated DC-DC converter delivers up to 16 A of output current in an industry-standard surface-mount package. Operating from a 9.6 - 14V input, the YS12S16-0G converter is an ideal choice for Intermediate Bus Architectures where Point-of-Load (POL) power delivery is generally a requirement. It provides an extremely tightly-regulated programmable output voltage from 0.7525 V to 5.5 V.
The Y12S16-0G converter provides exceptional thermal performance, even in high temperature environments with minimal airflow. No derating is required up to 85 °C, even without airflow at natural convection. This performance is accomplished through the use of advanced circuitry, packaging, and processing techniques to achieve a design possessing ultra-high efficiency, excellent thermal management, and a very low-body profile. The low-body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with advanced power electronics and thermal design, results in a product with extremely high reliability.
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