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- DOSA Compliant industry standard package
- 9.6V - 14V Input voltage range
- No derating up to 85ºC, Start-up at -40ºC
- Exceptional thermal performance with minimal airflow
- MTBFs up to 69 million hours
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RoHS lead free and lead-solder-exempted products are available
Delivers up to 5 A
No derating up to 85 °C
Surface-Mount package
Industry-standard footprint and pinout
Small size and low profile:
0.80” x 0.45” x 0.247”
20.32 mm x 11.43 mm x 6.27 mm
Weight: 0.08 oz [2.22 g]
Coplanarity less than 0.003”, maximum
Synchronous Buck Converter topology
Start up into pre-biased output
No minimum load required
Programmable output voltage via external resistor
Operating ambient temperature: -40 °C to 85 °C
Remote ON/OFF
Fixed frequency operation
Auto-reset output over-current protection
Auto-reset over-temperature protection
High reliability, MTBF approx. 69 Million Hours calculated per Telcordia TR-332, Method I Case 1
All materials meet UL94, V-0 flammability rating
UL60950 recognition in U.S. & Canada, and DEMKO certification per IEC/EN60950)
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Applications
Intermediate Bus Architectures
Telecommunications
Data communications
Distributed Power Architectures
Servers, workstations
Benefits
High efficiency no heat sink required
Reduces total solution board area
Tape and reel packing
Compatible with pick & place equipment
Minimizes part numbers in inventory
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Power-One’s point-of-load converters are recommended for use with regulated bus converters in an Intermediate
Bus Architecture (IBA). The YM12S05-0G non-isolated dc-dc converters deliver up to 5 A of output current in an
industry-standard surface-mount package. Operating from a 12V V input, these converters are ideal choices
for Intermediate Bus Architectures where Point-of-Load (POL) power delivery is generally a requirement. They
provide an extremely tight regulated programmable output voltage from 0.7525 V to 5.5 V.
The Y-Series of converters provides exceptional thermal performance, even in high temperature environments
with minimal airflow. No derating is required up to 85 C, even without airflow at natural convection. This
performance is accomplished through the use of advanced circuitry, packaging and processing techniques to
achieve a design possessing ultra-high efficiency, excellent thermal management and a very low-body profile.
The low-body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability. |
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