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- Industry standard SIP Package
- Wide input voltage range: 4.5 - 13.8V
- 36.8 x 8.6 x 15.5mm package
- Exceptional thermal performance with minimal airflow
- MTBFs up to 64 million hours
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• RoHS lead free and lead-solder-exempt products are available
• High efficiency synchronous buck topology
• Low noise fixed frequency operation
• Wide input voltage range: 4.5V - 13.8V
• High continuous output current: 20A
• Programmable output voltage range: 0.59V - 5.1V
• Overcurrent, and output overvoltage protections with automatic restart
• Enable input
• Start up into prebiased load
• No minimum load requirements
• High MTBF of 64 million hours
• Industry standard size through-hole single-in-line package and pinout
• 1.45”x0.34” (36.8mm x 8.6mm)
• Low height of 0.65” (16.51mm)
• Wide operating temperature range: 0 to 70ºC
• UL94 V-0 flammability rating
• UL60950, CSA C22.2 No. 60950-00, and TUV EN60950-1:2001 (pending)
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Applications
• Low voltage, high density systems with Intermediate Bus Architectures (IBA)
• Point-of-load regulators for high performance DSP, FPGA, ASIC, and microprocessors
• Desktops, servers, and portable computing
• Broadband, networking, optical, and communications systems
Benefits
• One part that covers many applications
• Reduces board space, system cost and complexity, and time to market |
| Power-One’s point-of-load converters are recommended for use with regulated bus converters in an Intermediate Bus Architecture (IBA). The YEV09T20-0G, non-isolated DC-DC point of load (POL) converter, delivers up to 20A of output current in an industry-standard single-in-line (SIP) through-hole package. The YEV09T20-0G POL converter is an ideal choice for Intermediate Bus Architectures where point of load conversion is a requirement.
Operating from a 4.5-13.8V input the POL converter provides an extremely tightly regulated programmable output voltage of 0.59V to 5.1V. The POL converter offers exceptional thermal performance, even in high temperature environments with minimal airflow. This performance is accomplished through the use of advanced circuit solutions, packaging and processing techniques. The resulting design possesses ultra-high efficiency, excellent thermal management, and a slim body profile that minimizes impedance to system airflow, thus enhancing cooling for both upstream and downstream devices. The use of automation for assembly, coupled with advanced power electronics and thermal design, results in a product with extremely high reliability.
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